Global Top 15 Companies Accounted for 59% of total Silver Powder and Paste for Electronic Components | |
According to the new market research report “Global Silver Powder and Paste for Electronic Components Market Report 2023-2029”, published by QYResearch, the global Silver Powder and Paste for Electronic Components market size is projected to reach USD 0.68 billion by 2029, at a CAGR of 2.1% during the forecast period. The global key manufacturers of Silver Powder and Paste for Electronic Components include Shoei Chemical, Heraeus, CNMC, Mitsui Kinzoku, ZHEJIANG CHANGGUI METAL POWDER CO.LTD, Kunming Noble Metal Electronic Materials CO.LED, Fukuda, TongLing Nonferrous Metals Group Holdings Co.,Ltd, NINGBO JINGXIN ELECTRONIC MATERIAL CO., LTD., Ames Goldsmith, etc. In 2022, the global top five players had a share approximately 59.0% in terms of revenue. For more information, please contact the following e-mail address: Email: global@qyresearch.com Website: https://www.qyresearch.com | |
Target State: All States Target City : All Cities Last Update : 07 May 2024 11:39 AM Number of Views: 62 | Item Owner : Frank Contact Email: (None) Contact Phone: (None) |
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