global top 16 companies accounted for 60% of total Chip On Film Underfill (COF) market (Business Opportunities - Other Business Ads)
AUNetAds > Business Opportunities > Other Business Ads
Item ID 2410055 in Category: Business Opportunities - Other Business Ads
global top 16 companies accounted for 60% of total Chip On Film Underfill (COF) market | |
Underfills serve the purpose of equalizing stresses between chip and substrate. Chips are attached directly to the interconnection points without intermediate elements. Stresses arise at the solder bumps when the electronic modules are heated and cooled during operation due to the different coefficients of thermal expansion of the substrates. Underfill technology was developed to counteract these mechanical influences. The Chip On Film Underfill (COF) market covers Capillary Underfill (CUF), No Flow Underfill (NUF), Non-Conductive Paste (NCP) Underfill, Non-Conductive Film (NCF) Underfill, Molded Underfill (MUF) Underfill, etc. The typical players include Namics Corporation, AI Technology, Henkel, Shenzhen Dover, Darbond, LORD Corporation, Panacol, Won Chemical, etc. The global key manufacturers of Chip On Film Underfill (COF) include Master Bond, AI Technology, Darbond, MacDermid (Alpha Advanced Materials), AIM Solder, Zymet, Bondline, Shin-Etsu Chemical, Shin-Etsu Chemical, Bondline, etc. In 2021, the global top five players had a share approximately 60.0% in terms of revenue. For more information, please contact the following e-mail address: Email: global@qyresearch.com Website: https://www.qyresearch.com  | |
| Target State: All States Target City : All Cities Last Update : 13 May 2024 12:53 PM Number of Views: 79 | Item Owner : David Contact Email: (None) Contact Phone: (None) |
| Friendly reminder: Click here to read some tips. | |
AUNetAds > Business Opportunities > Other Business Ads
© 2024 AUNetAds.com
USNetAds.com | GetJob.us | CANetAds.com | UKAdsList.com | INNetAds.com | CNNetAds.com | Hot-Web-Ads.com | USAOnlineClassifieds.com
2024-11-22 (0.320 sec)