Global Top 4 Companies Accounted for 79% of total Back Grinding Tapes (BGT) market (Business Opportunities - Other Business Ads)
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Global Top 4 Companies Accounted for 79% of total Back Grinding Tapes (BGT) market | |
BGT (Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling. The global key manufacturers of Back Grinding Tapes (BGT) include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, etc. In 2022, the global top four players had a share approximately 79.0% in terms of revenue. For more information, please contact the following e-mail address: Email: global@qyresearch.com Website: https://www.qyresearch.com  | |
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2024-11-22 (0.253 sec)