BGA Assembly Quality Is Determined By Many Factors | |
The accurate placing of BGA components on circuit boards is entirely dependent on the precision of chip mounters, which often include a particular positioning mechanism capable of assisting with the accurate positioning of BGA components. Furthermore, certain chip mounters can examine BGA solder balls for co-planarity and identify faults such as missing balls, which is incredibly useful in improving BGA soldering reliability. Contact info:- https://efpcb.wordpress.com/2024/05/28/bga-assembly-quality-is-determined-by-many-factors/ | |
Related Link: Click here to visit item owner's website (1 hit) | |
Target State: All States Target City : Shenzhen Last Update : 01 July 2024 10:39 PM Number of Views: 97 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
Friendly reminder: Click here to read some tips. |