BGA Assembly Quality Is Determined By Many Factors (Computers - Hardware)

Item ID 2438874 in Category: Computers - Hardware

BGA Assembly Quality Is Determined By Many Factors
The accurate placing of BGA components on circuit boards is entirely dependent on the precision of chip mounters, which often include a particular positioning mechanism capable of assisting with the accurate positioning of BGA components. Furthermore, certain chip mounters can examine BGA solder balls for co-planarity and identify faults such as missing balls, which is incredibly useful in improving BGA soldering reliability. Contact info:- https://efpcb.wordpress.com/2024/05/28/bga-assembly-quality-is-determined-by-many-factors/
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Target State: All States Target City : Shenzhen Last Update : 01 July 2024 10:39 PM Number of Views: 97	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2024-09-08 (0.223 sec)