BOC package substrate (Computers - Hardware)

Item ID 2493024 in Category: Computers - Hardware

BOC package substrate
The electronics world today is changing with the improvement in the size of semiconductor technology. One of the most important facets that have made this innovation possible is the Ball-on-Chip (BOC) package substrate. BOC substrates though hidden have the great responsibility of providing an enabling environment for the latest gadgets right from smartphones to high-performance computers to perform optimally. In this blog, let me explain what BOC package substrate are, the need, and the role of these substrates in contemporary electronics. Contact Info:- High Quality PCB Co., Limited Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China Plant 2 address: Zhuhai, Guangdong, China Plant 3 address: Dongguan, Guangdong, China TEL: +86-755-23724206 WahtsApp: +86-189 2381 2997 Skype: shawnwang2006 Email: sales@efpcb.com

Target State: All States Target City : Shenzhen Last Update : 30 September 2024 9:22 PM Number of Views: 114	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2024-11-22 (0.230 sec)