Package Substrates are the Backbone of Semiconductor Packaging (Computers - Hardware)

Item ID 2493151 in Category: Computers - Hardware

Package Substrates are the Backbone of Semiconductor Packaging
Package substrates, also known as interposers or printed circuit boards (PCBs), are the foundation upon which semiconductor devices are built. They are typically made of materials like fiberglass-reinforced epoxy (FR-4), ceramics, or more advanced materials like silicon or laminate substrates with copper traces. These substrates offer a platform for mounting and interconnecting the various IC components, such as the die, wire bonds, and external pins or balls. Contact info:- https://efpcb.weebly.com/blog/package-substrates-are-the-backbone-of-semiconductor-packaging
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Target State: All States Target City : Shenzhen Last Update : 01 October 2024 1:32 AM Number of Views: 95	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2024-10-31 (0.284 sec)