CSP Substrate Technology: Fundamentals and Applications (Computers - Hardware)

Item ID 2511589 in Category: Computers - Hardware

CSP Substrate Technology: Fundamentals and Applications
CSP substrate is one of the IC bundling advancements that is utilized in the development of microelectronic frameworks. The size of the bundle ultimately depends on 1 and it very well may be a blend of parts of the number or just the initial segment. Twice the bite the dust size of the real pass on with a solitary kick the bucket bundle which has direct surface mounts capacity. It was first evolved during the 1990s because of huge prerequisites for little as well as productive bundles. Contact info:- https://efpcb.wordpress.com/2024/09/25/csp-substrate-technology-fundamentals-and-applications/
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Target State: All States Target City : Shenzhen Last Update : 03 November 2024 1:59 AM Number of Views: 62	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2024-12-23 (0.787 sec)