Flip Chip CSP Substrate: Efficiency, Reliability, and Application (Computers - Hardware)
Item ID 2512852 in Category: Computers - Hardware
Flip Chip CSP Substrate: Efficiency, Reliability, and Application | |
A flip chip essentially implies that the chip is flipped over to make an association with the substrate or lead outline. Flip chip doesn't rely upon the wire holding for of interconnection however it utilizes weld or knocks like copper support point. This implies that the I/O cushions can be set at any segment of the outer layer of the chip and hence the chip size can be diminished with a fitting hardware way. This is credited to the way that the shortfall of a holding wire adds to the minimization of transmission inductance. Contact info:- https://efpcb.wordpress.com/2024/09/25/flip-chip-csp-substrate-efficiency-reliability-and-application/ | |
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| Target State: All States Target City : Shenzhen Last Update : 05 November 2024 7:49 PM Number of Views: 60 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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2024-11-22 (0.224 sec)