Flip Chip CSP Substrate: Efficiency, Reliability, and Application (Computers - Hardware)
Item ID 2566594 in Category: Computers - Hardware
Flip Chip CSP Substrate: Efficiency, Reliability, and Application | |
A flip chip essentially implies that the chip is flipped over to make an association with the substrate or lead outline. Flip chip doesn't rely upon the wire holding for of interconnection however it utilizes bind or knocks like copper point of support. This implies that the I/O cushions can be put at any segment of the outer layer of the chip and consequently the chip size can be decreased with a proper hardware way. Contact info:- https://efpcb.wordpress.com/2024/09/25/flip-chip-csp-substrate-efficiency-reliability-and-application/ | |
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| Target State: All States Target City : Shenzhen Last Update : 03 February 2025 8:55 PM Number of Views: 61 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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2025-02-22 (0.338 sec)